Electronics Forum | Tue Aug 04 12:32:13 EDT 1998 | Bob Willis
The design rules for solder thiefs are that the extra pads must be bigger than the proceeding pads to be worth while as a minimum guide the pad is 3x the size of the proceeding pad so if the pad is 0.030" the thief would be 0.090" wide. As steve has
Electronics Forum | Mon Oct 19 17:43:12 EDT 1998 | John Gregory
Ryan - I noticed your comment concerning solid solder and was compeled to drop a note. We have developed a process which uses some material characteristics from earlier efforts with this technology and profiled it for flip chip and area array attach
Electronics Forum | Mon Oct 19 17:45:25 EDT 1998 | John Gregory
Dave - I noticed your comment concerning solid solder and was compeled to drop a note. We have developed a process which uses some material characteristics from earlier efforts with this technology and profiled it for flip chip and area array attach
Electronics Forum | Fri Jul 24 02:32:35 EDT 1998 | Frank J. de Klein
| Hi, | We have encountered one serious problem that heavy packages falling down during second side reflow, especially for PLCC 84. I believe it caused by temperature profile setting. | Any good suggestion would be highly appreciated! | Stoney Tsai *
Electronics Forum | Fri Jul 24 10:36:48 EDT 1998 | Dave F
| | Hi, | | We have encountered one serious problem that heavy packages falling down during second side reflow, especially for PLCC 84. I believe it caused by temperature profile setting. | | Any good suggestion would be highly appreciated! | | Stone
Electronics Forum | Wed Jul 22 13:50:49 EDT 1998 | Justin Medernach
| My firm has just begun it's first PCB that will use BGA packaging. I have been reading up on the processes involved with BGAs and was wondering if you need to apply solder paste to the pads prior to applying heat and mounting the part to the board
Electronics Forum | Wed Jul 22 20:33:02 EDT 1998 | Dave F
| hi....i am new at this technology and would like to know more about smt... | presently iam studying in an engineering field and one of the subject required me to make a studies about smt technologies...if anyone out there know where i might find a
Electronics Forum | Mon Jul 20 10:38:18 EDT 1998 | John
| hi....i am new at this technology and would like to know more about smt... | presently iam studying in an engineering field and one of the subject required me to make a studies about smt technologies...if anyone out there know where i might find a
Electronics Forum | Thu Jul 09 21:31:07 EDT 1998 | Dave F
There's a company out the that makes air sleds for moving equipment around. Air sleds are heavy duty plastic plastic bags with lots of little holes in the under-side. The bag is positioned under the equipment. A vacuum cleaner, hooked-up backwards
Electronics Forum | Tue Jul 07 12:52:02 EDT 1998 | Upinder Singh
Thanks Earl. Well following is the data regarding the product. 1. The panel consists of 21 boards. 2. The surface I mentioned would have 3 SMds and 1 T/hole connector. 3. PCB thickness is 55 mils and the width of the hole on the PCB for the thru-
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