Electronics Forum: tabs (Page 26 of 33)

Coin Cell Battery

Electronics Forum | Wed Aug 14 21:13:30 EDT 2002 | davef

Insulating tab approach, like: * Go to page 5 of http://www.kalatel.com/lit-rack/install-man/kts_253_253-16_man.pdf * http://support.tandy.com/support_radios/doc64/64039.htm * Go to �Fixing�, Step 6 of http://www.sunvic.co.uk/TLX%20Digital%20Room%2

Wave Soldering - Icicling/Bridges

Electronics Forum | Fri Jan 24 16:46:21 EST 2003 | MA/NY DDave

Hi, Distance Engineering is always difficult. I am guessing that the old machine and process ran wonderfully / acceptable. If you still have the old machine, how about running an empty board through it and then the new machine. Without flux observ

Rivscrew� Good Bad Ugly

Electronics Forum | Wed Nov 10 15:18:15 EST 2004 | Dave G

Let's go for Ugly..... I've used these in the past for attaching connectors to boards and tabbed Transistors to extruded Aluminum heatsinks with mixed results. The concept is great but, in practice there are some headaches to deal with. We've gotten

Solder in via holes causing printing problems

Electronics Forum | Thu Jan 06 06:15:49 EST 2005 | mattkehoe

We need some opinions about a situation that is causing problems in our process. The pcb's in question are .125 thick with a HASL finish. The boards are coming in with a large amount of solder trapped inside the via holes. Sometimes this solder is ac

component to scored edge clearance

Electronics Forum | Mon Jun 20 09:12:55 EDT 2005 | davef

There's no easy answer. It depends on: * Thickness and size of the PCB in the array. * Means of separation. * Type of component. SMT components are more sensitive to the forces that need to be applied to separate the PCB. * Type SMT device. Ceram

0.4mm PCB Thickness - production issues

Electronics Forum | Thu Sep 14 19:19:38 EDT 2006 | SWAG

I would try to panelize as big as you can for sure as you'll spend more time handling single boards than running anything. Additionally, this size is very close to smallest capabilities on GSM depending on your configuration. Fids on all boards in

BGA opens / cracks

Electronics Forum | Sun Feb 04 15:06:20 EST 2007 | Scotty

Profile should have a longer cool soak. Verify as was mentioned all pin/fixture support through out the entire process. Print, Place, pre reflow hand load, post reflow, carriers, ICT, Depanel and FCT. Conformal Coated or Potted? Mylars work well for

PCB Array Designs

Electronics Forum | Tue Jun 05 12:12:19 EDT 2007 | SWAG

We do not recommend array sizes. PCB houses take a single board and turn it into a step/repeat that is best fit for their process = cheaper boards I suppose. We then approve this array and build programs and tooling to match. On occasion, we recei

ive solder profiles

Electronics Forum | Mon Aug 04 16:20:35 EDT 2008 | patrickbruneel

After analyzing the pictures I don't think the solder balls are caused by the solder mask. If the problem would be solder mask related the solder balls would only show up on the solder mask but there are also solder balls on the plastic tabs. To me i

NEW to Philips Topaz-X need help programming

Electronics Forum | Fri Sep 26 09:47:34 EDT 2008 | kevslatvin

I hope this doesn't add any confusion. I save my data as a .csv file and bring that into Cad2cad. This is how I was shown to do it by Assembleon. To use .csv you have to set your file format on the format cad file tab(during import to Cad2cad) to Cha


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