Electronics Forum: test pad (Page 1 of 61)

Print solder paste on test pad on OSP board

Electronics Forum | Fri Sep 10 09:39:32 EDT 2004 | Bryan Sherh

Dears, I've a board with OSP surface finish,and I planned to print solder paste on the test pad for easy ICT, because the probe can't reach the OSP covered pad.But to my surprise,after reflow there's much flux residue on top of test pad(or solder) an

Print solder paste on test pad on OSP board

Electronics Forum | Sun Sep 12 08:30:29 EDT 2004 | davef

Well, another alternative is to use a water washable flux. If you insist on staying with a NC flux, use one that is probable. We prefer to probe solder, rather than copper.

Print solder paste on test pad on OSP board

Electronics Forum | Mon Sep 13 18:34:31 EDT 2004 | russ

Use Water soluble if you can, if not I would try the Indium SMQ NC paste, this residue stays soft. I would also change ICT probes to the "drill type". Russ

Print solder paste on test pad on OSP board

Electronics Forum | Mon Sep 27 11:40:50 EDT 2004 | grayman

use water soluble solder paste is the cure for your problem. but if you insist of using NC change your pogo pins to pointed pins.

Print solder paste on test pad on OSP board

Electronics Forum | Tue Sep 14 08:14:07 EDT 2004 | Rob

Hi, There are "Fluxbuster" or "Rotator" pins on the market - we had to use them a few years ago on a flexy board (with OSP). There is some info from one source at the following link: http://www.isiconnectors.com/mfrs/idi/idipr.htm#Rotator We got

via as test point

Electronics Forum | Mon Feb 26 20:02:42 EST 2001 | davef

First, I don�t understand why your board fabricator can�t do a good job plugging your vias. Additionally, when you consider that they forgot to plug the first batch of boards, it makes me wonder if they are desirable as a supplier. Generally, we us

BGA Pull test

Electronics Forum | Mon Oct 25 17:50:46 EDT 2004 | Mike

I work for a PCB Manufacture and I am looking for info on BGA Pull test or strenght test. I have a CM that is experiencing bga's with some weak joints. they are telling me that when they do their pull test the joints are breaking at the nickel inste

BGA Pull test

Electronics Forum | Tue Oct 26 08:41:56 EDT 2004 | Bob R.

When we first got into BGAs on ENIG we were getting joint cracking at in-circuit test. The joints were breaking in the Sn-Ni intermetallic. We did a lot of pull testing while working with our board suppliers and our conclusion was that pull testing

BGA Pull test

Electronics Forum | Mon Oct 25 21:49:14 EDT 2004 | davef

First, any results of pull or shear tests are unscientific at best. [We pop our BGA from boards with, appropriately enough, a beverage can opener.] Second, we have no have problems with your ENIG specification. Third, as with your customer, we'd e

Dye Pry test

Electronics Forum | Thu Oct 24 14:10:53 EDT 2002 | Terry Burnette

I've been informed that I can't post the Dye Penetrant paper on the SMTNET library till Advanced Packaging releases the paper in their Dec. issue. You should be able to pull a copy in the next couple of weeks from their site, http://ap.pennnet.com/ho

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