Electronics Forum | Thu Aug 27 18:22:37 EDT 2009 | zombie
Hello, thanks for the help. Since this is only for prototypes we can avoid lead-free. Also our boards are not that big or thick. On the other side, our parts are small, the smallest is 1.5x1mm. Would the DRS24 work? What brand is usally more affor
Electronics Forum | Wed Sep 09 08:25:40 EDT 2009 | davef
We understand that you have boards in production that you need to ship. In the future, you could eliminate your moisture caused blow hole issue a lot more simply than baking. Consider requiring that your board fab plate the copper thickness of throug
Electronics Forum | Thu Aug 27 11:35:07 EDT 2009 | davef
There are many possibilities: * Conformal coat is incompatible with surface residue on the board * Conformal coat is incompatible with solder mask on the board * Moisture is out-gassing from the board * Conformal coat is too thick and does not allow
Electronics Forum | Fri Oct 30 09:19:46 EDT 2009 | cab
We have performed some EDS analysis and found high percent (approx 18% ) of Ni on surface of gold pad. Found Tungsten as well. This is an HTCC alumina package. Thickness of gold was confirmed and found to be in spec. We believe we are dealing wi
Electronics Forum | Tue Oct 27 22:52:18 EDT 2009 | davef
Top picture: We're not wild about the 'poor registration,' the differing thickness of the solder mask, and the crud all over the board. But, then again, we don't have a basis for rejection. Bottom picture: No basis for rejection Help us out, what do
Electronics Forum | Tue Feb 16 21:29:18 EST 2010 | actioncontrols
I predict you will have no problems with your soldering. Remember that all plating is only a few microns thick and quickly washed away by the molten solder. We have used white tin, immersion gold, OSG, etc. for quite a while with leaded solder and
Electronics Forum | Wed Apr 07 17:03:50 EDT 2010 | duchoang
Hi Mabdalla, Attached is my VIOS file. The board dimension in your file is 285.75(L) x 215.90(W) I do not see the board thickness in your file. The dimension in my file is 192.7(L) x 153.67(W) x 1.8(T) Hope this info would help you a little.
Electronics Forum | Fri Apr 09 20:47:36 EDT 2010 | 89jeong
I think the oxidation on the pad happens easily but do not on Au plated pad.The reason may be caused by improper cleaning or Au plating thickness in plating process. But,before suspecting the pcb board, you need to check your process or used material
Electronics Forum | Mon May 24 13:11:12 EDT 2010 | deanm
A guideline that I use agrees with MikeS: For 20mil pitch, apertures should be 9-10mil with a stencil thickness of 5-6mils to achieve an acceptable aspect ratio of 1.7. Just be sure you are using a mesh Type 3 or 4 solder paste. Otherwise, larger par
Electronics Forum | Sat Aug 21 15:07:34 EDT 2010 | jry74
I have a problem with solder bridging between IC leads, especially fine pitch leads. If we lessen the apature ratio and/or decrease stencil thickness, I have more of a chance for unsoldered or insufficent joints. I am looking for any information th
