Electronics Forum | Thu Jun 17 10:25:43 EDT 1999 | Brian Wycoff
| | We are a medium sized PCB assy. house manufacturing about 2000 motherboards a day. There is a major problem we are facing at the wave soldering stage, i.e. warpage of the PCB. As soon as the PCB touches the wave it warps severely from the centr
Electronics Forum | Tue Jul 20 14:17:34 EDT 1999 | Curtis
| We are a medium sized PCB assy. house manufacturing about 2000 motherboards a day. There is a major problem we are facing at the wave soldering stage, i.e. warpage of the PCB. As soon as the PCB touches the wave it warps severely from the centre
Electronics Forum | Thu Jun 03 17:24:03 EDT 1999 | Steve A
| Hi everybody, | | Somebody know the advantages of electroformed stencils on laser cut stencils ? | | any coment is apreciated. | | | thanks | | Al | Hey Al, An Electroformed (an additive process) stencil is comparable quality wise as a laser
Electronics Forum | Fri Jun 04 09:20:55 EDT 1999 | HST-SE
Al, We make stencils, and I was personally involved at AMTX when the electroformed process was developed. Some of this will sound like an ad, but everyone has been volunteering vendors and so look at this as a suggestion. Electroforming is an addit
Electronics Forum | Thu May 20 11:51:37 EDT 1999 | KT
| I'm running memory module product- SMT double reflow ( 12 modules per panel). I'm using the epoxy base solder paste in order to reduce the flux spattering problem onto the gold finger which could lead to the intermittent contact problem. | | I do
Electronics Forum | Wed May 05 23:26:29 EDT 1999 | Dean
| OK, my manager read an article on printing glue (aaargghh!)and wants to know why we aren't doing it. We currently use Fuji GLs and GDMs to dispense glue. I've never done it, but have seen it done at NEPCON and other shows. It looks OK, BUT what
Electronics Forum | Tue Apr 27 13:58:15 EDT 1999 | Scott McKee
| Board Experts | | I am fighting with a board house about a delamination problem.. First the facts | 1) 10 layer board .063 thick HASL Finish Aprox 16 in x 17 in. | 2) 150 Boards with this part number built with the same reflow oven settings (2
Electronics Forum | Tue Apr 27 17:22:40 EDT 1999 | Dave F
| Board Experts | | I am fighting with a board house about a delamination problem.. First the facts | 1) 10 layer board .063 thick HASL Finish Aprox 16 in x 17 in. | 2) 150 Boards with this part number built with the same reflow oven settings (2
Electronics Forum | Tue Apr 13 09:11:54 EDT 1999 | Dave F
| We process both tin/lead plated boards and gold plated boards in our surface mount group. I have used Sn62/Pb36/Ag2 solder paste on all gold plated boards to help prevent gold scavaging. To reduce the amount of different solder pastes we have to
Electronics Forum | Fri Apr 16 11:07:53 EDT 1999 | Vic Lau
| | We process both tin/lead plated boards and gold plated boards in our surface mount group. I have used Sn62/Pb36/Ag2 solder paste on all gold plated boards to help prevent gold scavaging. To reduce the amount of different solder pastes we have t
