Electronics Forum | Thu Apr 15 10:44:28 EDT 2010 | dwonch
Dumb question maybe but does the board have a layer count window? Usually each layer has it's number visible in copper somewhere on the board and the shop will leave the solder mask clear of this window. If the layers were stacked incorrectly it woul
Electronics Forum | Thu Apr 08 13:28:24 EDT 2010 | mabdalla
Thanks DucHoang, One more favor. Will really appreciate if you can point us on how to figure out the number of patterns (number of offsets) from the VIOS file. Also we would like to know the feeder types represented by the numbers in the &F sectio
Electronics Forum | Fri Apr 02 04:02:18 EDT 2010 | manju2cool
Hi, I think concept of inspection through AOI is changing. I am struck in confusion.Because some manufacturer say 3D inspection, with 1+4 cameras is ultimate solution. Orbotech also came with 13 cameras at once!Now some say, all these are eyewashing
Electronics Forum | Fri Apr 02 14:11:21 EDT 2010 | bigdaddysoy9
Manjunath, I prefer orthogonal systems. In my experience they are actually better at detecting coplanarity and HIP defects than multi camera systems. They are obviously limited, in that they can not inspect a component under another component, b
Electronics Forum | Fri Apr 09 07:47:51 EDT 2010 | jdengler
Hi John, Our ERSA rework station came with a soldering iron that has a few special tips. We normally do not have a stencil and use tacky flux, so I use the concave tip to prep the pads. This leaves solder on the pads but with a little practice you
Electronics Forum | Fri Apr 09 09:08:40 EDT 2010 | cast2010
Hello, I produce two types of board. - 100% Thru Hole - 50% thru hole and 50% SMT For the second, I have a bad wetting after the reflow on the top. The pcb board have Au-Ni pad. I use a water soluble paste. I clean the board with a solution with
Electronics Forum | Fri Apr 09 15:00:04 EDT 2010 | davef
So for your SMT1/SMT2/PTH boards, you have poor solderability during SMT2. [Even if you have no SMT2 and only ST1/PTH, our answer is the same.] We assume this occurs on one board part number only. We guess that your bare boards have insufficient gol
Electronics Forum | Tue Apr 13 08:21:05 EDT 2010 | esca
Hi manchella, After ATC test, two different failure modes can be present: solder FATIGUE (into bulk) or BRITTLE INTERMETALLIC fracture. So, first you have to verify this. Moreover, which brand of SMT paste have you used ? The crack into solder joint
Electronics Forum | Wed Apr 21 14:38:30 EDT 2010 | remullis
Newer Universal Conveyors use 4 wire smema and FUJI should accomodate this protocol in its config screens. Old Universal Conveyors and some machines used SMPI (forget how many wires), You can purchase the 4 wire smema cable from UIC and conversio
Electronics Forum | Fri Apr 16 11:36:33 EDT 2010 | fönsi
Thank you for the links. I didn't know that there are companys that build test systems for ultrasonic inspection. My idea was to use a ultrasonic detector similar to crack inspection, for example to detect if the cooling pad is melted, or a solder jo
