Electronics Forum: timely (Page 566 of 1082)

Flying Probe

Electronics Forum | Sat Jul 29 13:30:17 EDT 2006 | Chunks

Some have a bottom side adaptor plates with pins to make contact to certain areas of your board. The top side may have one or multiple heads that can move the entire area of your board. On each of these haeds is a pin like that from an ICT machine.

SAC305 Solder Balling

Electronics Forum | Thu Aug 17 10:30:08 EDT 2006 | Chunks

Hi McGill, The straight ramp is "straight" from the manufacturers of the material. Using old process techniques from your old process materials no longer applies. We all miss the good old days, but it�s time to move on. Being of Asian descent, I t

Pcb immersion tin thickness

Electronics Forum | Mon Aug 07 09:04:09 EDT 2006 | molos21

Hi everyone, I am starting to use the lead free process and I had a few wetting problems (solder did not reach top side) at the wave soldering process once the pcb had passed our smt line (one heat pass). From what I understand, I have had a problem

Paste-in-Hole reflow soldering

Electronics Forum | Wed Aug 09 07:32:11 EDT 2006 | mumtaz

The curled legs may push the paste out of the hole, making things messy. This also will decrease your volume of paste which means your solder joints are not as robust as you would like. Also with this process, voiding can be a big issue depending o

Time to Setup a New Assembly Line

Electronics Forum | Fri Aug 18 02:17:50 EDT 2006 | Grant

Hi, We put in a bunch of Fuji XP machines and it took a good 4 days before we were up an running in full production, and this was with the local engineers helping us run the machines and help us as each little issue popped up, such as feeder change

Solder paste life cycle inside incubator

Electronics Forum | Tue Aug 15 15:26:56 EDT 2006 | Ben Jong

HI, I had a question for very generalise questionires from my Kitting dept with very usual enquiries prompting me that : For the after open seal solder paste tube later kept inside storage, how long that half way use solder paste can be still conside

Solder Ball After Reflow Process

Electronics Forum | Wed Aug 16 13:29:51 EDT 2006 | SWAG

Is 811 lead paste? If so, it seems to me that your oven settings are getting into soak awful fast in zone 2 and your peak is way high. Unless you are doing a thick board or something like that, those oven settings seem aggressive and might result i

Dover Coporation selling Vitronics Soltec

Electronics Forum | Fri Sep 01 15:33:29 EDT 2006 | Cmiller

Rick, I think Autosplice and Berg did that but of course, it was a little before my time. But the comparison is the same as what HP does with injet printers and the ink cartridges which for some reason made me think of a screen printer someone made t

BGA Repair Medium

Electronics Forum | Fri Aug 25 10:29:13 EDT 2006 | Chunks

With tacky flux, the BGA is not as reliable as one that was never repaired. I believe Dave stated that the higher offset may have something to do with it. Also with tacky flux, the ball collapse form side to side varies a bit. Sometimes a ball(s)

UIC Sold

Electronics Forum | Tue Sep 05 10:05:25 EDT 2006 | slthomas

"The new owners are supposed to make some significant investments in Universal so it may very well be a good thing for them. I have talked to a number of people there over the past few weeks and they are all excited about the change." I have been th


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