Electronics Forum | Tue Jul 20 12:49:38 EDT 2004 | mmjm_1099
We are having a problem with our Heller 1800W oven with certian parts skewing. It seems that some inductors and taller Can caps are shifting around in the oven. It seems it will solder fine and than all of a sudden just be off to one side or the othe
Electronics Forum | Fri Jul 30 05:21:04 EDT 2004 | vinitverma
I would also like to add some more features of Assembleon XII platform. You had mentined that you already have GSM machine whose feeders could be used if you buy a new GSM machine. Assembleon XII machines such as Opal XII, can use GSM feeders as we
Electronics Forum | Tue Aug 17 10:09:34 EDT 2004 | Phil Z
From my perspective, regardless of the size of your company, you want the best value for your money and latest, greatest in innovation. For pick and place, while Mydata, Siemens and Assembleon/Yamaha all have some cool and worthy concepts and worth e
Electronics Forum | Tue Aug 31 10:48:36 EDT 2004 | mriddle
Rob and JohnR The ASC/Samsung VSS Series AOI uses white LEDS and high-speed, high-resolution digital color cameras for image acquistion. While it can inspect for correct color by comparing RGB or HSL values, it does solder inspection by acquiring a
Electronics Forum | Tue Aug 24 23:04:14 EDT 2004 | pdeuel
If this code is on a ceramic cap then it is a 0.1uf cap. We have a conversion charts that list most all codes. Useing the last 2 digets only determine the value. The capatol letters A thru Z are given specfic numerical value. Example A0 is 1.0pf, A1
Electronics Forum | Wed Aug 25 19:35:48 EDT 2004 | russ
This is highly dependent upon your board, vision inspection, part rotation, part type, layout, number of P/Ns per (1 pers or 100 pers) feeder layout, optimization, nozzle changes, etc... all have significant impact on placement speed. I find if you
Electronics Forum | Sun Aug 29 19:17:34 EDT 2004 | aqueous
Chen, It is always best to place one�s effort on determining the cause and content of the residue rather than trying to work around it. The first thing you must determine is the nature of the residue. Is it flux? In many instances, the residue is
Electronics Forum | Tue Aug 31 13:23:37 EDT 2004 | frankracine
Thanks Ken for your reply. Concerning OSP, there are a few negative points that I must considered for our application. I've read all the following points in an Entek document. Never test it. - If you have a miss print and you clean the PCB, the co
Electronics Forum | Tue Aug 31 21:45:49 EDT 2004 | KEN
I have experienced this directly in SMT and wave solder. Fillet lift (can) be a direct indicator to lead enrichment (but its not the exclusive symptom). Lead enrichment in smt joints reduces the interfacial strength shortening the time to creep f
Electronics Forum | Tue Sep 14 14:52:22 EDT 2004 | Carol
During processing, the solder in the vias reflows and forms solder balls. PCBs have solder in random PBGA vias from the board manufacturer.The manufacturer says this is a result of the HASL process and is unavoidable. We use HASL finish, multilayer,
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