Electronics Forum | Tue May 12 04:15:48 EDT 1998 | Chris Sargent
Help! We have been doing some trials on Paste Through Hole and have encountered a problem. The screen is designed (as is suggested in technical info re PTH) to give double the paste volume required to fill the void between the pin and via. The pro
Electronics Forum | Fri May 31 18:00:55 EDT 2013 | hegemon
With regards to first picture.(Large themal vias) I would attempt to measure the area of the ground pad, less the area of the "drain" holes or Thermal Vias. From that result I would reduce the aperture to account for about 50% coverage of that remai
Electronics Forum | Tue Jul 06 18:16:14 EDT 1999 | Boca
| | Is anyone aware of some guidelines regarding through-hole in SMT pads? One of our designers wants to add through-hole leads in some SMT pads for an inductor. The size of the hole is 0.032 inches and takes-up approximately 25% of the pad area.
Electronics Forum | Mon Sep 09 10:50:24 EDT 2002 | bmulcahy
Hi MK, It not really as simple as changing from one to the other. VIA hole, PTH hole sizes may need to be changed. Really the designer should re-evalaute the board before changing. Also remember your soldering profiles, both reflow and wave (if appl
Electronics Forum | Tue Mar 07 20:33:26 EST 2023 | SMTA-72027903
Hello We have recently started to work with press fit but we are finding problems to reach the specifications in terms of hole deformation and whiskers. Do someone have experience in key process parameters and PCB design specifications (PCB harness,
Electronics Forum | Thu Jul 29 11:34:27 EDT 1999 | Justin Medernach
| | | | | | Presently protos of micro-bgas (80i/o) pitch .030/.031 | | | | | | 12BGA per assembly | | | | | | | | | | | | The board is a (.062, 4 layers) FR-4 using Dry film | | | | | | Pads .014inch | | | | | | Vias within footprint .020inch | | |
Electronics Forum | Thu Jul 29 15:29:30 EDT 1999 | Earl Moon
| | | | | | | Presently protos of micro-bgas (80i/o) pitch .030/.031 | | | | | | | 12BGA per assembly | | | | | | | | | | | | | | The board is a (.062, 4 layers) FR-4 using Dry film | | | | | | | Pads .014inch | | | | | | | Vias within footprint .02
Electronics Forum | Thu Jun 03 22:18:36 EDT 1999 | Dave F
| I'm encountering a new problem at my new company that I haven't encountered before in my past life - and that's Wave Soldering VIA holes. | | We've been getting a rash of defects that we call in this company, "insufficient solder in VIA hole." The
Electronics Forum | Mon Sep 09 21:02:30 EDT 2002 | davef
Bernard Interesting point. Please help us better understand: * Why do 'VIA hole, PTH hole sizes may need to be changed', aside from the obvious with hole-to-lead clearance? * What should the designer 're-evalaute the board before changing'? * What
Electronics Forum | Sun Jan 06 22:14:57 EST 2008 | mac88
If the machine or machines couldn't recognize the fiducials, you can grind it with a fiberglass eraser. If the fiducial are missing you can use tooling holes, and/or via holes. You can verify the hole size and tolerance on the PCB assembly drawing.
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