Electronics Forum | Fri Sep 11 15:20:53 EDT 2020 | rsatmech
Yes it's 0201. Homeplate design is not recommended. Simple going to reduce the aperture size. Just planning to reduce it in both the pad cornor. What's your recommendation.
Electronics Forum | Sat Sep 12 01:30:39 EDT 2020 | rsatmech
Thanks for the information. Much appreciated. We are using 79um thickness stencil. I will share the inputs to my stencil manufacturer.
Electronics Forum | Thu Sep 17 06:53:55 EDT 2020 | ameenullakhan
Hi Srini, Good day !! I the issue resolved. Which stencil design you used. We have similar kind of issue in 0402 package. very random failures. 192 part placement . randomly 1 or 2 component fail. Regards, Ameen
Electronics Forum | Wed Sep 23 13:00:08 EDT 2020 | rsatmech
Hi Ameen, As I said before my defect rate is 0.001% and i am planning to reduce the stencil opening only. Will share the result once I implement it. Expected to complete it withing next week. Thank you.
Electronics Forum | Fri Sep 25 05:03:26 EDT 2020 | ameenullakhan
Hi Srini, Thanks a lot. Please share me the design you will be implementing. It will be very helpful. Regards, Ameen
Electronics Forum | Sun Oct 18 03:01:41 EDT 2020 | rsatmech
Hi All, Thanks for your response and support. Attached is the design used. I found out the below design details in another model. Can used this also. 0.28x0.24 mm is the dimensions available in other model (no tombstone issue occurring).
Electronics Forum | Wed Sep 09 10:37:40 EDT 2020 | SMTA-64386317
Hi, Anybody knew what is appropriate bump height for BGA that will be ideal for underfill process. The undefill must be strong enough to hold the component.
Electronics Forum | Sat Sep 12 08:01:59 EDT 2020 | majdi4
Could you just share with us those information : *BGA datasheet ?? *Stencil design ?? *Stencil Thikness ?? *Type of under-film you want to work with : adhesive or self-adhesive ??
Electronics Forum | Fri Sep 25 09:51:53 EDT 2020 | majdi4
I didn't understand your request.. Are you talking about underfill process (dispensing) or underfill with tape and reel packaging?? does the component drops at the 2nd reflow? that's why you want to go ahead for underfill process?? Thank you .
Electronics Forum | Wed Sep 09 17:24:49 EDT 2020 | kumar
For Conformal coating machine to mask the components which material(silicon or SS) make masking boots is beeter interms of Cost,cycle time,Reusable lifecycle
