Electronics Forum | Sun Jul 26 22:35:55 EDT 1998 | D.Lange
Masdi, Try board shunts. They are hi-temp rubber strips with grooves cut. They can be popped on and off with ease and are much faster than taping and considerably cheaper. They also work great for masking goldfingers prior to wave soldering. Contac
Electronics Forum | Thu May 28 22:49:32 EDT 1998 | D. Lange
| I have a component that is glue cured on the bottom of a pcb. The component is a 1206 size jumper. It is made up of iron/nickel alloy. The problem I am having is that the part will fall off the board during wave solder. Is the component not abl
Electronics Forum | Thu May 28 08:56:12 EDT 1998 | Earl Moon
| I have a component that is glue cured on the bottom of a pcb. The component is a 1206 size jumper. It is made up of iron/nickel alloy. The problem I am having is that the part will fall off the board during wave solder. Is the component not abl
Electronics Forum | Wed Nov 28 18:24:05 EST 2001 | mparker
Back in the days when pots, skillets, etc. were made of cast iron, vegetable oils were used to "season" the iron to prevent rusting and also from the food sticking to the pot during cooking. It would be reasonable to believe that you could use the sa
Electronics Forum | Fri Dec 07 13:15:45 EST 2001 | slthomas
We've experienced similar problems with film caps, specifically Panasonic's parts that are alledgedly compatible with both reflow and wave soldering. They are identified with either GB or JB p/n suffixes, which become either GX, GC, or JC for the ref
Electronics Forum | Mon Jan 07 21:07:00 EST 2002 | davef
Using a flux pen sounds like a good idea. Comments are: * I assume you�re talking aqueous flux. If not, some NC flux pens leave white residues. Nearly all of 15 samples suffered to varying degrees with white residues. * Use the same flux that you
Electronics Forum | Tue Jul 16 01:28:48 EDT 2002 | ppcbs
Our BGA Rework process has resulted in 100% yield. We always bake BGA chips at 125 degrees C for at least 8 hours before installation. We always bake loaded boards at 90 degrees C for at least 12 hours before BGA removal. Any parts that went throug
Electronics Forum | Fri Jul 08 09:57:31 EDT 2005 | fctassembly
Proy, Another issue is what exact formulation of SAC is used. Much of the SAC305 being used in Asia contains phosphorus, which is added in an attempt to reduce the heavy drossing that SAC305 produces. Phosphorus acts as a flux on steel so will increa
Electronics Forum | Fri Aug 12 09:50:19 EDT 2005 | fctassembly
It is true that the SAC alloys are very aggressive to unprotected solder pots but the SN100C lead free alloy can be used in these pots IF they are not already being wetted by your SN63 alloy. FCT Assembly offers a program that includes free tin wash
Electronics Forum | Thu Jan 12 11:25:06 EST 2006 | Cmiller
We tested SAC305 in our selective solder machine and found the dross production made it an unnaceptable choice of alloy. Personaly, I cant imagine dross in a joint being a good thing but if it is a very small amount and does not occur very often, y
