Electronics Forum | Sat Jan 23 16:07:20 EST 1999 | Steve Gregory
| hi, | i am working towards developing a no-clean process for a customer at contract manufacturing facility. the assemblies have gold fingers on them. these are masked to prevent from any damage to them during reflow soldering. the earlier proces
Electronics Forum | Fri Jan 22 18:54:54 EST 1999 | Steve Gregory
> If you are inheriting a system, you probably don't have a lot of choice, >>but with a little ingenuity, you can pull a Steve Gregory: Grab some duct >>tape, a book of matches, and a videotaped rerun of MacGyver for >>inspiration. HEY! Whaddya mea
Electronics Forum | Tue Jan 12 10:18:36 EST 1999 | Russ Steiner
| Any idea what the "industry standard" is for fall out on assembled PCB's? I realize that the controls put in place in your processes will effect your overall quality. But I'm trying for a general answer. On pre-tested assemblies, should you exp
Electronics Forum | Tue Dec 29 12:57:08 EST 1998 | Earl Moon
| Does anyone have angles on how to reduce N2 consumption at reflow process (i.e. process control equipment, etc.)? | | Any help would be appreciated | N2 consumption is very "machine" and process dependent. Some machine designs are better equipped
Electronics Forum | Fri Nov 13 23:33:33 EST 1998 | Kallol Chakraborty
| | | I believe that gold fingers on my circuit boards are being | | | contaminated and need to clean them with some chemical | | | solution. Any recommendations. | | | | | Chuck: What is the type and source of your contamination? Dave F | | We a
Electronics Forum | Sat Nov 14 08:00:34 EST 1998 | Earl Moon
| Also the preheating of the board is done to help evaporate any water/alcohol that is in the flux - water is a big problem in No-clean processes. From our experience, a temp range around 200f - no more than 220f is ideal for the bigger boards, but t
Electronics Forum | Mon Nov 02 13:24:18 EST 1998 | Ryan Jennens
| Well my process is I'm running my belt speed at 3.50fpm and about 215 to 225 degrees top side. I got my main wave down to a little less than half the board thickness. I'm not using a hot air knife cause we thought it might create more of a problem
Electronics Forum | Fri Oct 23 09:44:43 EDT 1998 | Chrys
| We've got a continous flow cooling problem from our wave solder process into ICT. Our current configuration is a flatbelt conveyor into a manual de-pallet process, operator then places on to an edge conveyor. We've tried muffin fans, look good bu
Electronics Forum | Fri Oct 23 15:44:57 EDT 1998 | Mike
| We've got a continous flow cooling problem from our wave solder process into ICT. Our current configuration is a flatbelt conveyor into a manual de-pallet process, operator then places on to an edge conveyor. We've tried muffin fans, look good bu
Electronics Forum | Wed Oct 07 15:15:04 EDT 1998 | Joe P.
| I am currently experimenting with Pin-To-Paste reflow. does anyone know some excellent references or links that could give me tips and tricks, optimal aperature dimensions, etc. I have been informed that if I have pull through that I should put a
