Electronics Forum | Tue Feb 16 16:28:30 EST 1999 | Tuffty
| | Can anyone help me with the pros and cons of trying to wave | | solder tantalum and large (1812) ceramic capacitors. I do | | know that one may see fractures on larger cermaic caps, but have not seen much on the tantalums. Any insight as to what
Electronics Forum | Thu Feb 04 16:08:05 EST 1999 | Ryan Jennens
| I realize it's been discussed many times before. I need to know your opinions, experience, and knowledge concerning "today's"/latest and best pallet designs, suppliers, and methods for using them more effectively. | | Thanks much, | | Earl Moon |
Electronics Forum | Thu Jan 14 16:32:58 EST 1999 | Dave Jurena
Hi all, I thought I'd use this forum to ask a couple general questions on fluxes for manual operations: First - Is it OK to use a wave soldering type flux (specifically OA)? Thinking about activation temperatures and the ramp rate of the wave solder
Electronics Forum | Wed Nov 11 00:42:15 EST 1998 | Jason
Mike, We retrofitted all of our waves with USI spray fluxers. We are running no-clean on 4 of our waves, and OA 2331-ZX, reduced specific gravity to .825, on the other 2 With OA you must buy a special spray head to accomadate higher pressure and l
Electronics Forum | Tue Nov 03 10:33:10 EST 1998 | Chrys
| We run stiffeners on all of our product through our wave solder process and most of our product through our reflow and adhesive cure oven. The problem is we continually put on and take off stiffeners because of poor reliability of stiffeners stayi
Electronics Forum | Wed Nov 04 16:56:27 EST 1998 | Chris Lampron
| | We run stiffeners on all of our product through our wave solder process and most of our product through our reflow and adhesive cure oven. The problem is we continually put on and take off stiffeners because of poor reliability of stiffeners sta
Electronics Forum | Mon Nov 02 09:44:21 EST 1998 | Michael Nguyen
Well my process is I'm running my belt speed at 3.50fpm and about 215 to 225 degrees top side. I got my main wave down to a little less than half the board thickness. I'm not using a hot air knife cause we thought it might create more of a problem th
Electronics Forum | Sat Oct 31 10:56:16 EST 1998 | Dennis Barry
| I finally got my problem figured out on the bridging, the | only thing I'm finding is that I notice some litlte solder balls on the bottom of the board. Is that normal? Is that why I'm getting bridges? Has anyone came across this problem and pass t
Electronics Forum | Fri Oct 23 09:29:29 EDT 1998 | Allen
We've got a continous flow cooling problem from our wave solder process into ICT. Our current configuration is a flatbelt conveyor into a manual de-pallet process, operator then places on to an edge conveyor. We've tried muffin fans, look good but
Electronics Forum | Thu Sep 17 08:02:16 EDT 1998 | Earl Moon
A couple of months ago I asked those with experience concerning Seho wave soldering machines to provide comments. Several responded. Thank you all. Now, I would ask about some operational tips concerning the model 2100/2200 machines. The operations m
winsouce.jpg)
