Electronics Forum | Wed May 07 15:26:05 EDT 2008 | joeherz
Interesting - We're using the same AIM products as you. On the lead free, 353, did you start out with it or did you try the WS485? That was the 1st product recommendation we got from AIM and we found that the lot to lot consistency was not good. T
Electronics Forum | Tue May 06 11:56:56 EDT 2008 | joeherz
We have a board that uses 0402x4 RNET packages that we are having a difficult time getting to solder consistently. Paste deposition is fine (using AIM WS353) and profile is dead-nuts. I'm starting to wonder if this is something that we're just goin
Electronics Forum | Tue Feb 29 10:14:02 EST 2000 | Robert Hartmann
My company is just getting into the flip chip packaging arena. We are putting in a prototype/small volume wire bond PBGA line. We have some questions with regard to choosing solder balls and cleaning of flux. 1) Is there a formula for the shrink
Electronics Forum | Tue Feb 29 10:14:02 EST 2000 | Robert Hartmann
My company is just getting into the flip chip packaging arena. We are putting in a prototype/small volume wire bond PBGA line. We have some questions with regard to choosing solder balls and cleaning of flux. 1) Is there a formula for the shrink
Electronics Forum | Thu Jul 13 13:52:28 EDT 2006 | George
Thanks Russ...
Electronics Forum | Tue Nov 02 05:00:28 EST 2004 | jysam
we are using solder paste WS609 and OM5100.Relow oven: forced convection type. For WS609 and OM5100, straight ramp up profile is suitable for low to medium thermal mass assemblies and preheating may be required for high thermal mass assemblies. How
Electronics Forum | Wed Jul 12 18:25:23 EDT 2006 | George
Hi everybody: I really need your expertise on this one. I was told that the flux 270WR from AIM is either No-clean or WS soluble depending on your needs. I read the TDS and it looks like it is....but..... Is there anybody out there using this or s
Electronics Forum | Wed Jul 12 19:13:18 EDT 2006 | russ
i have heard of washable no-cleans for about 6-8 years now. I would think that if SIR values are acceptable for end use then I would run with it. Russ
Electronics Forum | Wed Dec 04 09:24:52 EST 2002 | jseagle
I have found that preheating the solder pallets prior to use helps cut down on the solder balling. Also, we do not cool the pallets between passes and we use a spray fluxer because a hot pallet will knock down the head on a foam fluxer. We use WS f
Electronics Forum | Fri Jul 06 12:11:34 EDT 2007 | james
We are starting to see issues with using Kester WS R562 with lead free components. The joints look grainy on almost all of the 0402'2 and other small components. Some of the solder does not solder to the terminations. These are hybrid boards which
