Autorouting Techniques for Mulitchip Modules
Published: |
April 24, 2001 |
Author: |
John Cofield, Advanced Packaging Product Manager, Mentor Graphics Corporation |
Abstract: |
Many PCB designers are interested in taking advantage of Multichip Modules, but are unfamiliar with the technology. While the design process is very much the same, MCM manufacturing processes vary dramatically. MCM routing requirements are dictated by the manufacturing process and types of components. Components mounted on MCM substrates are predominantly, if not exclusively, bare chips. As a result, the component body and I/O pins are no longer constrained to industry standard pin counts and form factors as are packaged components...... |
|
Company Information:
More articles from Mentor Graphics »
- Apr 25, 2018 - Modeling And Optimizing Wire Harness Costs For Variation Complexity
- Feb 07, 2018 - Mixed Voltages And Aluminum Conductors: Assesing New Electrcal Technology
- Feb 01, 2018 - Electronic Does Not Equal Smart: Service Documentation and Brand Quality
- Jan 04, 2018 - IPC-1782 Standard for Traceability Supporting Counterfeit Components
- Apr 06, 2017 - Luceda Photonics Delivers a Silicon Photonics IC Solution in Tanner L-Edit.
- See all SMT / PCB technical articles from Mentor Graphics »
More SMT / PCB assembly technical articles »
- Aug 20, 2024 - Thermal Interface Materials Drive Electronic Innovation | GPD Global
- Aug 20, 2024 - Underfill Materials Dispensing in Electronics Manufacturing Applications | GPD Global
- Jul 15, 2024 - Transforming LED Manufacturing: I.C.T Engineers Set Up Complete Production Line in Tajikistan | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Jun 20, 2024 - Case study: Precise Coating on Electronic Hearing Devices | ASYMTEK Products | Nordson Electronics Solutions
- Mar 19, 2024 - What is Underfill | GPD Global
- Browse Technical Library »
Autorouting Techniques for Mulitchip Modules article has been viewed 546 times