StencilQuick™ Lead-Free Solder Paste Rework Study
Published: |
January 31, 2007 |
Author: |
Ray Cirimele, BEST Inc |
Abstract: |
The goal of this project is to evaluate the reliability of lead-free BGA solder joints with a variety of different pad sizes using several different BGA rework methods. These methods included BGAs reworked with both flux only and solder paste attachment techniques and with or without the use of the BEST stay in place StencilQuick™. The daisy chained test boards were placed into a thermal test chamber and cycled between -25ºC to 125ºC over a 30 minute cycle with a 30 minute dwell on each end of the cycle. Each BGA on the board was wired and the continuity assessed during the 1000 cycles the test samples were in the chamber. ... |
|
|
|
|
|
|
You must be a Company Information:
More articles from BEST Inc. »
- May 29, 2019 - Hand Printing using Nanocoated and other High End Stencil Materials
- Mar 30, 2017 - Solder Paste for BGA Rework | Multiple Methods for Applying Paste Flux
- Feb 01, 2017 - BGA Rework Process
- Oct 06, 2016 - PCB Laser Depanelizing Using a UV Laser
- Aug 27, 2015 - Adhesive Backed Plastic Stencils vs Mini Metal Stencils
- See all SMT / PCB technical articles from BEST Inc. »
More SMT / PCB assembly technical articles »
- Aug 20, 2024 - Thermal Interface Materials Drive Electronic Innovation | GPD Global
- Aug 20, 2024 - Underfill Materials Dispensing in Electronics Manufacturing Applications | GPD Global
- Jul 15, 2024 - Transforming LED Manufacturing: I.C.T Engineers Set Up Complete Production Line in Tajikistan | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Jun 20, 2024 - Case study: Precise Coating on Electronic Hearing Devices | ASYMTEK Products | Nordson Electronics Solutions
- Mar 19, 2024 - What is Underfill | GPD Global
- Browse Technical Library »
StencilQuick™ Lead-Free Solder Paste Rework Study article has been viewed 792 times
