BGA Thermal Shock Testing
Published: |
February 1, 2007 |
Author: |
Roy Johnson Senior Staff Engineer AG Communication Systems. |
Abstract: |
The purpose of the testing was to compare the resistance and check for open circuit conditions of reworked BGA test samples made with and without StencilQuik™ after 500 thermal shock cycles. StencilQuick™ is a product of Best Inc. In this series of tests, the resistance of daisy chain resistance patterns running between the BGA and test board after exposure to thermal shock was measured.... |
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