BGA Rework. A Comparative Study of Selective Solder Paste Deposition For Area Array Packages
Published: |
February 1, 2007 |
Author: |
Ray Cirimele, Best, Inc |
Abstract: |
The rapid assimilation of Ball Grid Array (BGA) and other Area Array Package technology in the electronics industry is due to the fact that this package type allows for a greater I/O count in a smaller area while maintaining a pitch that allows for ease of manufacture.... |
You must be a registered user to talk back to us. |
Company Information:
More articles from BEST Inc. »
- May 29, 2019 - Hand Printing using Nanocoated and other High End Stencil Materials
- Mar 30, 2017 - Solder Paste for BGA Rework | Multiple Methods for Applying Paste Flux
- Feb 01, 2017 - BGA Rework Process
- Oct 06, 2016 - PCB Laser Depanelizing Using a UV Laser
- Aug 27, 2015 - Adhesive Backed Plastic Stencils vs Mini Metal Stencils
- See all SMT / PCB technical articles from BEST Inc. »
More SMT / PCB assembly technical articles »
- Aug 20, 2024 - Thermal Interface Materials Drive Electronic Innovation | GPD Global
- Aug 20, 2024 - Underfill Materials Dispensing in Electronics Manufacturing Applications | GPD Global
- Jul 15, 2024 - Transforming LED Manufacturing: I.C.T Engineers Set Up Complete Production Line in Tajikistan | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Jun 20, 2024 - Case study: Precise Coating on Electronic Hearing Devices | ASYMTEK Products | Nordson Electronics Solutions
- Mar 19, 2024 - What is Underfill | GPD Global
- Browse Technical Library »
BGA Rework. A Comparative Study of Selective Solder Paste Deposition For Area Array Packages article has been viewed 698 times