Reflow Profiling: Time Above Liquidus
Published: |
December 20, 2007 |
Author: |
David Suraski |
Abstract: |
Despite much research and discussion on the subject of reflow profiling, many questions and a good deal of confusion still exist. What is clear is that the pains often associated with profiling can be reduced if there is a strong understanding of the variables that can be encountered during the reflow process, as well as the metallurgical dynamics of the soldering process. This paper shall provide a brief outline of the reflow profile in general, with specific emphasis placed upon the suggested time spent above the melting temperature of the solder. The guidelines for soldering to various surfaces and with alternative solder alloys also are discussed.... |
You must be a registered user to talk back to us. |
Company Information:
More articles from AIM Solder »
- Jun 20, 2022 - AIM Tech Tip Article: Pretty Slick
- Sep 26, 2018 - Assessing the Effectiveness of I/O Stencil Aperture Modifications on BTC Void Reduction
- Apr 13, 2017 - A Study to Determine the Impact of Solder Powder Mesh Size and Stencil Technology Advancement on Deposition Volume when Printing Solder Paste
- Feb 18, 2016 - Sample Preparation For Mitigating Tin Whiskers In Alternative Lead-Free Alloys
- Mar 04, 2015 - Conformal Coating over No Clean Flux Residues
- See all SMT / PCB technical articles from AIM Solder »
More SMT / PCB assembly technical articles »
- Jul 15, 2024 - Transforming LED Manufacturing: I.C.T Engineers Set Up Complete Production Line in Tajikistan | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Jun 20, 2024 - Case study: Precise Coating on Electronic Hearing Devices | ASYMTEK Products | Nordson Electronics Solutions
- Mar 19, 2024 - What is Underfill | GPD Global
- Mar 19, 2024 - Made in Japan: Solder Paste Jet Dispensing Machine | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Feb 26, 2024 - Precision Control in Electronic Assembly: Selective Wave Soldering Machine | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Browse Technical Library »
Reflow Profiling: Time Above Liquidus article has been viewed 993 times