Selective Soldering Process
Published: |
January 24, 2008 |
Author: |
Paul Bratt, Lead Package Engineer |
Abstract: |
Although many through-hole components are being replaced by their surface mount (SMT) counterparts, printed circuit boards (PCBs) are still being designed with both types of components. Often, there are interconnect hardware, displays, or other components that cannot withstand the exposure to the high temperature involved in the wave soldering process. They are generally soldered by hand. The challenge is to determine the optimal method manufacturers can use to solder these boards populated with mixed technology.... |
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