An Experimental and Computational Study of the Current Carrying Capacity of High Performance PWB Interconnections
Published: |
January 1, 2009 |
Author: |
Michael J. Rowlands and Vara Calmidi, Endicott Interconnect Technologiesogies |
Abstract: |
Recent technology advancement has enabled enhancement in PWB electrical performance and wiring density. These innovations have taken the form of improved materials, novel PWB interconnect structures, and manufacturing technology. One such advancement is Z-axis conductive interconnect. The Z-interconnect technology involves building mini-substrates of 2 or 3 layers each, then assembling several mini-substrates together using conductive paste.... |
You must be a registered user to talk back to us. |
Company Information:
More articles from i3 Electronics »
- Mar 13, 2023 - Printable Electronics: Towards Materials Development And Device Fabrication
- Aug 14, 2014 - Advanced Organic Substrate Technologies To Enable Extreme Electronics Miniaturization.
- May 05, 2011 - Manufacturing Substrates with Embedded Passives
- Dec 22, 2010 - Nanofluids, Nanogels and Nanopastes for Electronic Packaging
- Oct 28, 2010 - Organic Optical Waveguide Fabrication in a Manufacturing Environment
- See all SMT / PCB technical articles from i3 Electronics »
More SMT / PCB assembly technical articles »
- Aug 20, 2024 - Thermal Interface Materials Drive Electronic Innovation | GPD Global
- Aug 20, 2024 - Underfill Materials Dispensing in Electronics Manufacturing Applications | GPD Global
- Jul 15, 2024 - Transforming LED Manufacturing: I.C.T Engineers Set Up Complete Production Line in Tajikistan | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Jun 20, 2024 - Case study: Precise Coating on Electronic Hearing Devices | ASYMTEK Products | Nordson Electronics Solutions
- Mar 19, 2024 - What is Underfill | GPD Global
- Browse Technical Library »
An Experimental and Computational Study of the Current Carrying Capacity of High Performance PWB Interconnections article has been viewed 791 times