Cleaning High-power Electronics
Published: |
January 6, 2009 |
Author: |
Steve Stach, Austin America; Harald Wack, Ph.D., Naveen Ravindran, Zestron America; Joachim Becht, Zestron Europe |
Abstract: |
To prevent malfunctions in high-power electronics, flux residues must be removed from flip chip components prior to subsequent processes. As a result, integrating a suitable cleaning application into the manufacturing process of flip chip components is often required. Solvent based applications have re-emerged, and with that, an overall process solution is necessary.... |
You must be a registered user to talk back to us. |
Company Information:
More articles from ZESTRON Americas »
- Jul 04, 2023 - CLEANING BEFORE CONFORMAL COATING
- Apr 11, 2022 - iNEMI Webinar 07.07.2021 - PCB Cleaning
- Oct 20, 2021 - PCB Surface Finishes & The Cleaning Process - A Compatibility Study
- Oct 06, 2021 - Cleaning Before Conformal Coating
- Nov 04, 2020 - Higher Defluxing Temperature and Low Standoff Component Cleaning - A Connection?
- See all SMT / PCB technical articles from ZESTRON Americas »
More SMT / PCB assembly technical articles »
- Aug 20, 2024 - Thermal Interface Materials Drive Electronic Innovation | GPD Global
- Aug 20, 2024 - Underfill Materials Dispensing in Electronics Manufacturing Applications | GPD Global
- Jul 15, 2024 - Transforming LED Manufacturing: I.C.T Engineers Set Up Complete Production Line in Tajikistan | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Jun 20, 2024 - Case study: Precise Coating on Electronic Hearing Devices | ASYMTEK Products | Nordson Electronics Solutions
- Mar 19, 2024 - What is Underfill | GPD Global
- Browse Technical Library »
Cleaning High-power Electronics article has been viewed 1145 times