SnCu Based Alloy Design for Lower Copper Dissolution and Better Process Control
Published: |
February 13, 2009 |
Author: |
Peter Biocca, Senior Engineer, Technical Manager; Kester ITW, |
Abstract: |
To meet the market demand for a best-in-class, low-cost leadfree alloy for wave, selective and dip soldering... |
You must be a registered user to talk back to us. |
Company Information:
- Jul 20, 2017 - Reactivity Of No-Clean Flux Residues Trapped Under Bottom Terminated Components
- May 17, 2017 - How to Use the Right Flux for the Selective Soldering Application
- Dec 29, 2016 - Partially-Activated Flux Residue Impacts on Electronic Assembly Reliabilities
- Oct 23, 2012 - Lead-free SMT Soldering Defects How to Prevent Them
- Jan 15, 2009 - Creating Solder Joint Reliability with SnCu Based Solders Some Practical Experiences
- See all SMT / PCB technical articles from Kester »
More SMT / PCB assembly technical articles »
- Jun 20, 2024 - Case study: Precise Coating on Electronic Hearing Devices | ASYMTEK Products | Nordson Electronics Solutions
- Mar 19, 2024 - What is Underfill | GPD Global
- Mar 19, 2024 - Made in Japan: Solder Paste Jet Dispensing Machine | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Feb 26, 2024 - Precision Control in Electronic Assembly: Selective Wave Soldering Machine | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Feb 02, 2024 - Maximizing Efficiency: The High-Speed SMT Line With Laser Depanelizer | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Browse Technical Library »
SnCu Based Alloy Design for Lower Copper Dissolution and Better Process Control article has been viewed 913 times