How Clean Is Clean?
Published: |
March 19, 2009 |
Author: |
Michael Konrad, President; Aqueous Technologies Corporation |
Abstract: |
Over the past several years, post-reflow defluxing of circuit assemblies has gained in popularity. Microminiaturization of components and boards, combined with higher expected reliability and increased product liability, have contributed to the prominence of defluxing. Lead-free solder paste - with its higher reflow temperatures and negative effects on flux - increase the likelihood of post-reflow defluxing to increase a product's reliability and aesthetic appearance.... |
|
|
|
|
|
|
You must be a Company Information:
More articles from Aqueous Technologies Corporation »
- Aug 17, 2022 - Stencil Cleaning Handbook
- Jul 27, 2021 - ECM And IOT How To Predict, Quantify, And Mitigate ECM Failure Potential
- Jun 28, 2021 - The Reasons for Cleaning
- Sep 30, 2009 - The Environmental Cost of Green
- Aug 19, 2009 - De-fluxing Eases
- See all SMT / PCB technical articles from Aqueous Technologies Corporation »
More SMT / PCB assembly technical articles »
- Aug 20, 2024 - Thermal Interface Materials Drive Electronic Innovation | GPD Global
- Aug 20, 2024 - Underfill Materials Dispensing in Electronics Manufacturing Applications | GPD Global
- Jul 15, 2024 - Transforming LED Manufacturing: I.C.T Engineers Set Up Complete Production Line in Tajikistan | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Jun 20, 2024 - Case study: Precise Coating on Electronic Hearing Devices | ASYMTEK Products | Nordson Electronics Solutions
- Mar 19, 2024 - What is Underfill | GPD Global
- Browse Technical Library »
How Clean Is Clean? article has been viewed 1051 times
