Flexible Termination - Reliability in Stringent Environments
Published: |
May 21, 2009 |
Author: |
John Prymak, Corey Antoniades, Peter Blais, Allen Hill, Ken Lai, Mark Laps, Kevin Lynn, Reggie Phillips, Corey Riedl, Axel Schmidt, Bill Sloka, Paul Staubli; KEMET Corporation. |
Abstract: |
Failure due to board flex cracks persists as the dominant failure mode in multi-layer ceramic capacitors (MLCC). (...) This paper is intended to show the impact of temperature cycling, high-temperature life tests, and multiple bend exposures to the MLCC with this flexible termination.... |
|
|
|
|
|
|
You must be a Company Information:
More articles from KEMET Electronics Corporation »
- Jan 22, 2015 - High Temperature Ceramic Capacitors for Deep Well Applications
- Jul 07, 2011 - SMD Naked Capacitors Technologies For Severe Application Environments And Circuit Functions
- Jun 02, 2009 - Soldering of SMD Film Capacitors in Practical Lead Free Processes
- Oct 23, 2008 - Flex Crack Mitigation
- Sep 04, 2008 - Facedown Low-Inductance Solder Pad and Via Schemes
- See all SMT / PCB technical articles from KEMET Electronics Corporation »
More SMT / PCB assembly technical articles »
- Aug 20, 2024 - Thermal Interface Materials Drive Electronic Innovation | GPD Global
- Aug 20, 2024 - Underfill Materials Dispensing in Electronics Manufacturing Applications | GPD Global
- Jul 15, 2024 - Transforming LED Manufacturing: I.C.T Engineers Set Up Complete Production Line in Tajikistan | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Jun 20, 2024 - Case study: Precise Coating on Electronic Hearing Devices | ASYMTEK Products | Nordson Electronics Solutions
- Mar 19, 2024 - What is Underfill | GPD Global
- Browse Technical Library »
Flexible Termination - Reliability in Stringent Environments article has been viewed 913 times
 hitech.gif)
