Soldering of SMD Film Capacitors in Practical Lead Free Processes
Published: |
June 2, 2009 |
Author: |
Matti Niskala, Product Manager; Evox Rifa Group Oyj, a KEMET Company. |
Abstract: |
Today the lead free soldering process is a must in commercial electronics and it is also coming more and more important in automative and industrial electronics sectors in the near future. The most common choices for lead free solders are different Tin-Solder-Copper (SAC) alloys. Processes using SAC solders cause extra stress, because of increased process temperatures, especially to the plastic materials.... |
|
|
|
|
|
|
You must be a Company Information:
More articles from KEMET Electronics Corporation »
- Jan 22, 2015 - High Temperature Ceramic Capacitors for Deep Well Applications
- Jul 07, 2011 - SMD Naked Capacitors Technologies For Severe Application Environments And Circuit Functions
- May 21, 2009 - Flexible Termination - Reliability in Stringent Environments
- Oct 23, 2008 - Flex Crack Mitigation
- Sep 04, 2008 - Facedown Low-Inductance Solder Pad and Via Schemes
- See all SMT / PCB technical articles from KEMET Electronics Corporation »
More SMT / PCB assembly technical articles »
- Jul 15, 2024 - Transforming LED Manufacturing: I.C.T Engineers Set Up Complete Production Line in Tajikistan | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Jun 20, 2024 - Case study: Precise Coating on Electronic Hearing Devices | ASYMTEK Products | Nordson Electronics Solutions
- Mar 19, 2024 - What is Underfill | GPD Global
- Mar 19, 2024 - Made in Japan: Solder Paste Jet Dispensing Machine | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Feb 26, 2024 - Precision Control in Electronic Assembly: Selective Wave Soldering Machine | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Browse Technical Library »
Soldering of SMD Film Capacitors in Practical Lead Free Processes article has been viewed 709 times
