01005 Assembly, the AOI route to optimizing yield
Published: |
July 15, 2009 |
Author: |
Cathy Combet, Ming-Ming Chang, Product Managers, Vi TECHNOLOGY, France. |
Abstract: |
The increasing demand for smaller & smaller portable electrical devices is leading to the increasing usage of extremely small components in the SMT assembly lines. With the introduction of 01005 packages in mass production, all the different stages of the line are facing new challenges: from board design, through component placement to reflow process. Each stage introduces some specific types of defect which are considered impossible to repair due to the small size of the package. AOI has become an essential tool to enable good yield in the assembly of 01005.... |
You must be a registered user to talk back to us. |
Company Information:
More articles from Vi TECHNOLOGY »
- Feb 23, 2012 - What is really inside your AOI?
- May 30, 2007 - Phase Convection™: The Lead-Free Solution
- See all SMT / PCB technical articles from Vi TECHNOLOGY »
More SMT / PCB assembly technical articles »
- Jun 20, 2024 - Case study: Precise Coating on Electronic Hearing Devices | ASYMTEK Products | Nordson Electronics Solutions
- Mar 19, 2024 - What is Underfill | GPD Global
- Mar 19, 2024 - Made in Japan: Solder Paste Jet Dispensing Machine | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Feb 26, 2024 - Precision Control in Electronic Assembly: Selective Wave Soldering Machine | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Feb 02, 2024 - Maximizing Efficiency: The High-Speed SMT Line With Laser Depanelizer | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Browse Technical Library »
01005 Assembly, the AOI route to optimizing yield article has been viewed 1049 times