Sustaining a Robust Fine Feature Printing Process

With the introduction of 01005 chip components and 0.3 mm pitch CSP devices, electronic component packaging is pushing surface mount technology to the limits of its potential. Miniaturization is driving the electronics industry to implement the smallest and tightest pitch components in order to meet their customer demands. But how much miniaturization is possible before there is a paradigm shift in the technology? At what point is solder paste no longer viable? How small of a feature can be printed with solder paste, and can this process be implemented into a production environment?...