Next-Generation Test Equipment For High-Volume Wafer Production
Published: |
June 23, 2010 |
Author: |
Kay Gastinger, Odd Løvhaugen |
Abstract: |
Quality control is one of the main bottlenecks in the production of micro-opto-electromechanical systems/microelectromechanical systems (MOEMS/MEMS) because each structure on a wafer is serially inspected and scanned stepwise over the entire wafer area. ... |
|
Company Information:
More articles from SPIE - International Society for Optical Engineering »
- Jun 24, 2010 - Conductive Adhesives Increase Microchip Packaging Density
- See all SMT / PCB technical articles from SPIE - International Society for Optical Engineering »
More SMT / PCB assembly technical articles »
- Jul 15, 2024 - Transforming LED Manufacturing: I.C.T Engineers Set Up Complete Production Line in Tajikistan | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Jun 20, 2024 - Case study: Precise Coating on Electronic Hearing Devices | ASYMTEK Products | Nordson Electronics Solutions
- Mar 19, 2024 - What is Underfill | GPD Global
- Mar 19, 2024 - Made in Japan: Solder Paste Jet Dispensing Machine | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Feb 26, 2024 - Precision Control in Electronic Assembly: Selective Wave Soldering Machine | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Browse Technical Library »
Next-Generation Test Equipment For High-Volume Wafer Production article has been viewed 631 times