Assessment of Residual Damage in Leadfree Electronics Subjected to Multiple Thermal Environments of Thermal Aging and Thermal Cycling
Published: |
October 21, 2010 |
Author: |
Pradeep Lall, Rahul Vaidya, Vikrant More, Kai Goebel, Jeff Suhling |
Abstract: |
Electronic systems are often stored for long periods prior to deployment in the intended environment. Aging has been previously shown to effect the reliability and constitutive behavior of second-level leadfree interconnects.... |
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