3D ICs With TSVs - Design Challenges And Requirements
Published: |
December 9, 2010 |
Author: |
Cadence |
Abstract: |
As demands accelerate for increasing density, higher bandwidths, and lower power, many IC design teams are looking up – to 3D ICs with through-silicon vias (TSVs). 3D ICs promise “more than Moore” integration by packing a great deal of functionality int... |
|
Company Information:
More articles from Cadence Design Systems, Inc. »
- Mar 15, 2012 - Successfully Designing FPGA-Based Systems
- Oct 06, 2011 - Development of a Design & Manufacturing Environment for Reliable and Cost- Effective PCB Embedding Technology
- Feb 25, 2010 - Building Differentiated Products Through Shorter, More Predictable Design Cycles.
- Aug 09, 1999 - Parasitic Extraction for Deep Submicron and Ultra-deep Submicron Designs
- See all SMT / PCB technical articles from Cadence Design Systems, Inc. »
More SMT / PCB assembly technical articles »
- Jul 15, 2024 - Transforming LED Manufacturing: I.C.T Engineers Set Up Complete Production Line in Tajikistan | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Jun 20, 2024 - Case study: Precise Coating on Electronic Hearing Devices | ASYMTEK Products | Nordson Electronics Solutions
- Mar 19, 2024 - What is Underfill | GPD Global
- Mar 19, 2024 - Made in Japan: Solder Paste Jet Dispensing Machine | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Feb 26, 2024 - Precision Control in Electronic Assembly: Selective Wave Soldering Machine | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Browse Technical Library »
3D ICs With TSVs - Design Challenges And Requirements article has been viewed 762 times