Are Separate Solder Flip-Chip Bonders Still Required?
Published: |
October 13, 2011 |
Author: |
Eric Klaver, Senior Product Manager, Assembléon. Patrick Huberts, Product Manager Semicon Market. |
Abstract: |
Increasing miniaturization is now encouraging manufacturers of handheld devices to stack bare dies or packages. As the process of manufacturing modules requires placing both passives and (stacked) bare dies, these two types of placement are merging very quickly into a single platform. That raises the question of whether SMT equipment will take over from traditional die bonders.... |
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