Solder Charge Grid Array: Advancements In The Technology Of Surface Mount Area Array Solder Joint Attachment
Published: |
December 29, 2011 |
Author: |
Jim Hines, Adam Stanczak, David Decker, Theeraphong Kanjanupathum |
Abstract: |
2011 IPC APEX EXPO Conference Article: Surface mount area arrays (SMAA) have been in existence for decades and are increasingly becoming more important as printed circuit board (PCB) assemblies become further complex with package miniaturization and densi... |
|
|
|
|
|
|
You must be a Company Information:
More SMT / PCB assembly technical articles »
- Aug 20, 2024 - Thermal Interface Materials Drive Electronic Innovation | GPD Global
- Aug 20, 2024 - Underfill Materials Dispensing in Electronics Manufacturing Applications | GPD Global
- Jul 15, 2024 - Transforming LED Manufacturing: I.C.T Engineers Set Up Complete Production Line in Tajikistan | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Jun 20, 2024 - Case study: Precise Coating on Electronic Hearing Devices | ASYMTEK Products | Nordson Electronics Solutions
- Mar 19, 2024 - What is Underfill | GPD Global
- Browse Technical Library »
Solder Charge Grid Array: Advancements In The Technology Of Surface Mount Area Array Solder Joint Attachment article has been viewed 783 times
.gif)
