Modeling and Control of SMT Manufacturing Lines Using Hybrid Dynamic Systems
Published: |
April 5, 2012 |
Author: |
L.G. Barajas, A. Kansal, A. Saxena, M. Egerstedt, A. Goldstein, E.W. Kamen |
Abstract: |
In this paper we show how hybrid control and modeling tech-niques can be put to work for solving a problem of industrial relevance in Surface Mount Technology (SMT) manufacturing. In particular, by closing the loop over the stencil printing process, we ob... |
You must be a registered user to talk back to us. |
Company Information:
More articles from Georgia Institute of Technology »
- Mar 16, 2023 - Conductive Anodic Filament (CAF) Formation: A Potential Reliability Problem for Fine-Line Circuits
- Mar 16, 2023 - Conductive Anodic Filament Failure: A Materials Perspective
- Mar 13, 2023 - Printed Electronics: Manufacturing Technologies and Applications
- Mar 13, 2023 - Modeling Resistance Increase In A Composite Ink Under Cyclic Loading
- Feb 09, 2022 - Additively Manufactured mm-Wave Multichip Modules With Fully Printed "Smart" Encapsulation Structures
- See all SMT / PCB technical articles from Georgia Institute of Technology »
More SMT / PCB assembly technical articles »
- Aug 20, 2024 - Thermal Interface Materials Drive Electronic Innovation | GPD Global
- Aug 20, 2024 - Underfill Materials Dispensing in Electronics Manufacturing Applications | GPD Global
- Jul 15, 2024 - Transforming LED Manufacturing: I.C.T Engineers Set Up Complete Production Line in Tajikistan | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Jun 20, 2024 - Case study: Precise Coating on Electronic Hearing Devices | ASYMTEK Products | Nordson Electronics Solutions
- Mar 19, 2024 - What is Underfill | GPD Global
- Browse Technical Library »
Modeling and Control of SMT Manufacturing Lines Using Hybrid Dynamic Systems article has been viewed times