Minimizing Voiding In QFN Packages Using Solder Preforms
Published: |
July 27, 2012 |
Author: |
Seth J. Homer, Ronald C. Lasky, PhD, PE |
Abstract: |
First published in the 2012 IPC APEX EXPO technical conference proceedings. The focus of this paper will quantify the preform requirements and process adjustments needed to use preforms in a standard SMT process. In addition, experimental data showing vo... |
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