Polyphenylene Ether Macromonomers. XI. Use in Non-Epoxy Printed Wiring Boards
Published: |
November 1, 2012 |
Author: |
Edward N. Peters, Scott M. Fisher, Hua Guo |
Abstract: |
First published in the 2012 IPC APEX EXPO technical conference proceedings. The continuous progression toward portable, high frequency microelectronic systems has placed high demands on material performance, notably low dielectric constants (Dk), low loss tangent (Df), low moisture uptake, and good thermal stability. Epoxy resins are the workhorses of the electronic industry. Significant performance enhancements have been obtained through the use of PPE telechelic macromonomers with epoxy resins. However, there is a ceiling on the performance obtainable from epoxy-based resins. Therefore, non-epoxy based dielectric materials are used to fulfill the need for higher performance.... |
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