Effect of Surface Oxide on the Melting Behavior of Lead-Free Solder Nanowires and Nanorods
Published: |
July 18, 2013 |
Author: |
Fan Gao, Karunaharan Rajathurai, Qingzhou Cui, Guangwen Zhou, Irene NkengforAcha, Zhiyong Gu |
Abstract: |
Lead-free nanosolders have shown promise in nanowire and nanoelectronics assembly. Among various important parameters, melting is the most fundamental property affecting the assembly process. Here we report that the melting behavior of tin and tin/silver nanowires and nanorods can be significantly affected by the surface oxide of nanosolders.... |
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