Oxide Thickness and Solderability Methodology to Determine Long Term Storage of BGAs and QFPs
Published: |
October 16, 2014 |
Author: |
Rama Hegde, senior member of technical staff; Freescale Semiconductor. |
Abstract: |
Key points are: *Long-term storage of BGA & QFP products may be required due to:
* Integrity of EOL products in terms of solderability needs to be verified.... |
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