Rework Challenges for Smart Phones and Tablets
Published: |
April 23, 2015 |
Author: |
Paul Wood Advanced Product Applications Manager APR/ BGA Products OK International / Metcal. |
Abstract: |
Smart phones are complex, costly devices and therefore need to be reworked correctly the first time. In order to meet the ever-growing demand for performance, the complexity of mobile devices has increased immensely, with more than a 70% greater number of packages now found inside of them than just a few years ago. For instance, 1080P HD camera and video capabilities are now available on most high end smart phones or tablet computers, making their production more elaborate and expensive. The printed circuit boards for these devices are no longer considered disposable goods, and their bill of materials start from $150.00, with higher end smart phones going up to $238.00, and tablets well over $300.00.... |
|
|
|
|
|
|
You must be a Company Information:
- Jan 02, 2019 - Risk Mitigation in Hand Soldering
- Feb 22, 2018 - Hand Soldering with Lead Free Alloys
- Aug 14, 2013 - Profiling for Successful BGA/CSP Rework
- Nov 27, 2012 - Effective Qualification of Soldering Iron Performance Criteria
- Nov 12, 2012 - Increase Your Process Control and Lower Cost of Ownership
- See all SMT / PCB technical articles from Metcal »
More SMT / PCB assembly technical articles »
- Aug 20, 2024 - Thermal Interface Materials Drive Electronic Innovation | GPD Global
- Aug 20, 2024 - Underfill Materials Dispensing in Electronics Manufacturing Applications | GPD Global
- Jul 15, 2024 - Transforming LED Manufacturing: I.C.T Engineers Set Up Complete Production Line in Tajikistan | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Jun 20, 2024 - Case study: Precise Coating on Electronic Hearing Devices | ASYMTEK Products | Nordson Electronics Solutions
- Mar 19, 2024 - What is Underfill | GPD Global
- Browse Technical Library »
Rework Challenges for Smart Phones and Tablets article has been viewed 1545 times
