HALT Testing of Backward Soldered BGAs on a Military Product
Published: |
November 19, 2015 |
Author: |
B. Gumpert, B. Fox, L. Woody |
Abstract: |
The move to lead free (Pb-free) electronics by the commercial industry has resulted in an increasing number of ball grid array components (BGAs) which are only available with Pb-free solder balls. The reliability of these devices is not well established when assembled using a standard tin-lead (SnPb) solder paste and reflow profile, known as a backward compatible process. Previous studies in processing mixed alloy solder joints have demonstrated the importance of using a reflow temperature high enough to achieve complete mixing of the SnPb solder paste with the Pb-free solder ball. Research has indicated that complete mixing can occur below the melting point of the Pb-free alloy and is dependent on a number of factors including solder ball composition, solder ball to solder paste ratio, and peak reflow times and temperatures. Increasing the lead content in the system enables full mixing of the solder joint with a reduced peak reflow temperature, however, previous research is conflicting regarding the effect that lead percentage has on solder joint reliability in this mixed alloy solder joint.... |
You must be a registered user to talk back to us. |
Company Information:
More articles from Lockheed Martin Corporation »
- Oct 04, 2022 - Counterfeit Materials Prevention
- Oct 22, 2015 - Tin Whisker Risk Management by Conformal Coating
- Jun 11, 2015 - Solder Paste Stencil Design for Optimal QFN Yield and Reliability
- See all SMT / PCB technical articles from Lockheed Martin Corporation »
More SMT / PCB assembly technical articles »
- Jul 15, 2024 - Transforming LED Manufacturing: I.C.T Engineers Set Up Complete Production Line in Tajikistan | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Jun 20, 2024 - Case study: Precise Coating on Electronic Hearing Devices | ASYMTEK Products | Nordson Electronics Solutions
- Mar 19, 2024 - What is Underfill | GPD Global
- Mar 19, 2024 - Made in Japan: Solder Paste Jet Dispensing Machine | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Feb 26, 2024 - Precision Control in Electronic Assembly: Selective Wave Soldering Machine | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Browse Technical Library »
HALT Testing of Backward Soldered BGAs on a Military Product article has been viewed 904 times