Intermetallic Compounds In Solar Cell Interconnections Including Lead-Free, Low Melting Point Solders
Published: |
October 5, 2017 |
Author: |
Torsten Geipel, Achim Kraft, Ulrich Eitner - ISE, Monja Moeller - Kiel University |
Abstract: |
Intermetallic compounds (IMC) in solder bonds are commonly considered critical for the reliability of interconnections. The microstructure and thermal aging characteristics of solder bonds of crystalline silicon solar cells are investigated, whereby two solders, Sn60Pb40 and a lead-free, low melting point alternative Sn41Bi57Ag2 are considered.... |
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