Deposition of Solder Paste into High Density Cavity Assemblies
Published: |
February 28, 2018 |
Author: |
Fernando Coma, Jeffrey Kennedy, Thilo Sack |
Abstract: |
Circuit functional density requirements continue to drive innovative approaches to high performance packaging. Some new approaches include; aggressive space reduction, embedded solutions, and those that offer some form of risk reduction and rework potential are now options that are being explored by customers. Requirements for assembly of these types of packages necessitate the deposition of solder paste and assembly of components into cavities of the substrates to gain z-axis density as well as area functional density. Advances in the fabrication of PWB’s with cavities using newly developed laser micro-fabrication processes along with increased circuit pitch density of 50 micron lines and spaces permit new applications for high performance electronic substrates. First published at SMTA Pan Pacific Symposium... |
You must be a registered user to talk back to us. |
Company Information:
More articles from Celestica Corporation »
- Feb 13, 2023 - Whisker Formation Induced by Component and Assembly Ionic Contamination
- Oct 11, 2022 - MECHANICAL FAILURES IN PB-FREE PROCESSING: EVALUATING THE EFFECT OF PAD CRATER DEFECTS ON PROCESS STRAIN LIMITS FOR BGA DEVICES
- Sep 08, 2021 - The Great SAC Debate: Comparing The Reliability Of SAC305 And SAC405 Solders In A Variety Of Applications
- Aug 20, 2015 - Implementing Robust Bead Probe Test Processes into Standard Pb-Free Assembly
- Jan 17, 2013 - Solving the ENIG Black Pad Problem: An ITRI Report on Round 2
- See all SMT / PCB technical articles from Celestica Corporation »
More SMT / PCB assembly technical articles »
- Jul 15, 2024 - Transforming LED Manufacturing: I.C.T Engineers Set Up Complete Production Line in Tajikistan | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Jun 20, 2024 - Case study: Precise Coating on Electronic Hearing Devices | ASYMTEK Products | Nordson Electronics Solutions
- Mar 19, 2024 - What is Underfill | GPD Global
- Mar 19, 2024 - Made in Japan: Solder Paste Jet Dispensing Machine | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Feb 26, 2024 - Precision Control in Electronic Assembly: Selective Wave Soldering Machine | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Browse Technical Library »
Deposition of Solder Paste into High Density Cavity Assemblies article has been viewed 929 times