Risk Mitigation in Hand Soldering
Published: |
January 2, 2019 |
Author: |
Robert Roush |
Abstract: |
Failed solder joints remain a constant source of printed circuit board failure. Soldering is the bonding of metallic surfaces via an intermetallic compound (IMC). The interaction between thermal energy delivery, flux chemistry, and solder chemistry creates the solder bond or joint. Today, reliability relies on visual inspection; operator experience and skill, control of influencers e.g. tip geometry, tip temperature, and collection and analysis of process data. Each factor involved with the formation of the solder joint is an element of risk and can affect either throughput or repeatability. Mitigating this risk in hand soldering requires the identification of these factors and a means to address them.... |
|
Company Information:
- Feb 22, 2018 - Hand Soldering with Lead Free Alloys
- Apr 23, 2015 - Rework Challenges for Smart Phones and Tablets
- Aug 14, 2013 - Profiling for Successful BGA/CSP Rework
- Nov 27, 2012 - Effective Qualification of Soldering Iron Performance Criteria
- Nov 12, 2012 - Increase Your Process Control and Lower Cost of Ownership
- See all SMT / PCB technical articles from Metcal »
More SMT / PCB assembly technical articles »
- Aug 20, 2024 - Thermal Interface Materials Drive Electronic Innovation | GPD Global
- Aug 20, 2024 - Underfill Materials Dispensing in Electronics Manufacturing Applications | GPD Global
- Jul 15, 2024 - Transforming LED Manufacturing: I.C.T Engineers Set Up Complete Production Line in Tajikistan | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Jun 20, 2024 - Case study: Precise Coating on Electronic Hearing Devices | ASYMTEK Products | Nordson Electronics Solutions
- Mar 19, 2024 - What is Underfill | GPD Global
- Browse Technical Library »
Risk Mitigation in Hand Soldering article has been viewed 1604 times