• SMTnet
  • »
  • Technical Library
  • »
  • High Frequency Dk and Df Test Methods Comparison High Density Packaging User Group (HDP) Project

High Frequency Dk and Df Test Methods Comparison High Density Packaging User Group (HDP) Project

Published:

February 6, 2019

Author:

Karl Sauter

Abstract:

The High Density Packaging (HDP) user group has completed a project to evaluate the majority of viable Dk (Dielectric Constant)/Df (Dissipation Factor) and delay/loss electrical test methods, with a focus on the methods used for speeds above 2 GHz. A comparison of test methods from 1 to 2 GHz through to higher test frequencies was desired, testing a variety of laminate materials (standard volume production with UL approval, low loss, and "halogen-free" laminate materials). Variations in the test board material resin content/construction and copper foil surface roughness/type were minimized. Problems with Dk/Df and loss test methods and discrepancies in results are identified, as well as possible correlations or relationships among these higher speed test methods....

  • Download High Frequency Dk and Df Test Methods Comparison High Density Packaging User Group (HDP) Project article
  • To read this article you need to have Adobe PDF installed

You must be a registered user to talk back to us.

 

Company Information:

Oracle Corporation is an American multinational computer technology corporation specializing primarily in developing and marketing database software and technology, cloud engineered systems, and enterprise software products.

Redwood Shores, California, USA

Consultant / Service Provider

  • Phone +1.650.506.7000

See Company Website »

Company Postings:

(1) technical library article

  • Jun 20, 2024 - Case study: Precise Coating on Electronic Hearing Devices | ASYMTEK Products | Nordson Electronics Solutions
  • Mar 19, 2024 - What is Underfill | GPD Global
  • Mar 19, 2024 - Made in Japan: Solder Paste Jet Dispensing Machine | I.C.T ( Dongguan ICT Technology Co., Ltd. )
  • Feb 26, 2024 - Precision Control in Electronic Assembly: Selective Wave Soldering Machine | I.C.T ( Dongguan ICT Technology Co., Ltd. )
  • Feb 02, 2024 - Maximizing Efficiency: The High-Speed SMT Line With Laser Depanelizer | I.C.T ( Dongguan ICT Technology Co., Ltd. )
  • Browse Technical Library »

High Frequency Dk and Df Test Methods Comparison High Density Packaging User Group (HDP) Project article has been viewed 740 times

  • SMTnet
  • »
  • Technical Library
  • »
  • High Frequency Dk and Df Test Methods Comparison High Density Packaging User Group (HDP) Project
Facility Closure

SMT spare parts - Qinyi Electronics