Reliability of ENEPIG by Sequential Thermal Cycling and Aging
Published: |
April 17, 2019 |
Author: |
Reza Ghaffarian, Ph.D. |
Abstract: |
Electroless nickel electroless palladium immersion gold (ENEPIG) surface finish for printed circuit board (PCB) has now become a key surface finish that is used for both tin-lead and lead-free solder assemblies. This paper presents the reliability of land grid array (LGA) component packages with 1156 pads assembled with tin-lead solder onto PCBs with an ENEPIG finish and then subjected to thermal cycling and then isothermal aging.... |
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