Cleaning
Published: |
May 23, 2019 |
Author: |
ACI Technologies, Inc. |
Abstract: |
Solvent and co-solvent cleaning involves the use of engineered solvents in a vapor phase system. The solvents classically used were Class 1 Ozone Depleting Substances, but new types of solvents have been developed that are less environmentally harmful. In some cases, isopropyl alcohol is used with a co-solvent. In these types of cleaning systems, a cloud of boiling vapor solvent is maintained between a boil sump and a cooling coil. When the items to be cleaned are immersed in the vapor cloud, the solvent condenses on the assemblies and acts to dissolve the residues. These processes usually involve a final rinse step outside of the vapor cloud to ensure that all dissolved residues are washed off the assemblies (Figure 1).... |
You must be a registered user to talk back to us. |
Company Information:
More articles from ACI Technologies, Inc. »
- Dec 07, 2020 - A Non-destructive Approach to Identify Intermittent Failure Locations on Printed Circuit Cards (PCC) that have been Temperature Cycle Tested
- Nov 09, 2020 - Ball Grid Array (BGA) Voiding Affecting Functionality
- Sep 02, 2020 - Reworking ALD Coatings
- Aug 05, 2020 - ALD of Alumina Ceramic Films for Hermetic Protection
- Jul 01, 2020 - Lead-Free Risk Mitigation -- A Case Study
- See all SMT / PCB technical articles from ACI Technologies, Inc. »
More SMT / PCB assembly technical articles »
- Aug 20, 2024 - Thermal Interface Materials Drive Electronic Innovation | GPD Global
- Aug 20, 2024 - Underfill Materials Dispensing in Electronics Manufacturing Applications | GPD Global
- Jul 15, 2024 - Transforming LED Manufacturing: I.C.T Engineers Set Up Complete Production Line in Tajikistan | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Jun 20, 2024 - Case study: Precise Coating on Electronic Hearing Devices | ASYMTEK Products | Nordson Electronics Solutions
- Mar 19, 2024 - What is Underfill | GPD Global
- Browse Technical Library »
Cleaning article has been viewed 594 times