Thermal Profiles - Why Getting Them Right is Important
Published: |
October 24, 2019 |
Author: |
Fred Dimock |
Abstract: |
Presentation given by Fred Dimock during a seminar at the American Competitiveness Institute, ACI. •Recipe vs. Profile •Material Properties •Why profiles are shaped like they are. •Obtaining profiles •TC Accuracy •Profilers •Test vehicles •Process Window – Eutectic vs. Lead Free •Heat transfer •Oven Control... |
|
|
|
|
|
|
You must be a Company Information:
More articles from BTU International »
- Apr 21, 2021 - Operation of a Vacuum Reflow Oven with Void Reduction Data
- Dec 06, 2007 - Lead-Free Solder Wafer Bumping
- Nov 08, 2007 - Making A Case for Continuous Furnaces
- Oct 10, 2007 - Maximizing Process Control with Controlled Convection Rates
- See all SMT / PCB technical articles from BTU International »
More SMT / PCB assembly technical articles »
- Jul 15, 2024 - Transforming LED Manufacturing: I.C.T Engineers Set Up Complete Production Line in Tajikistan | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Jun 20, 2024 - Case study: Precise Coating on Electronic Hearing Devices | ASYMTEK Products | Nordson Electronics Solutions
- Mar 19, 2024 - What is Underfill | GPD Global
- Mar 19, 2024 - Made in Japan: Solder Paste Jet Dispensing Machine | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Feb 26, 2024 - Precision Control in Electronic Assembly: Selective Wave Soldering Machine | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Browse Technical Library »
Thermal Profiles - Why Getting Them Right is Important article has been viewed 869 times
