Head-on-Pillow Defect Detection – X-ray Inspection Limitations
Published: |
May 26, 2020 |
Author: |
Lars Bruno and Benny Gustafson |
Abstract: |
Both the number and the variants of Ball Grid Array packages (BGAs) are tending to increase on network Printed Board Assemblies (PBAs)with sizes ranging from a few mm die size Wafer Level Packages (WLPs) with low ball count up to large multi-die System-in-Package (SiP) BGAs with 60-70 mm side lengths and thousands of I/Os.... |
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