Approaches for additive manufacturing of 3D electronic applications

Published:

September 16, 2020

Author:

Hoerber, J.; Glasschroeder, J.; Pfeffer, M.; Schilp, J.; Zaeh, M.; Franke, J.

Abstract:

Additive manufacturing processes typically used for mechanical parts can be combined with enhanced technologies for electronics production to enable a highly flexible manufacturing of personalized 3D electronic devices. To illustrate different approaches for implementing electrical and electronic functionality, conductive paths and electronic components were embedded in a powder bed printed substrate using an enhanced 3D printer. In addition, a modified Aerosol Jet printing process and assembly technologies adapted from the technology of Molded Interconnect Devices were applied to print circuit patterns and to electrically interconnect components on the surface of the 3D substrates....

  • Download Approaches for additive manufacturing of 3D electronic applications article
  • To read this article you need to have Adobe PDF installed

You must be a registered user to talk back to us.

 

Company Information:

See Company Website »

Company Postings:

(1) technical library article

  • Aug 20, 2024 - Thermal Interface Materials Drive Electronic Innovation | GPD Global
  • Aug 20, 2024 - Underfill Materials Dispensing in Electronics Manufacturing Applications | GPD Global
  • Jul 15, 2024 - Transforming LED Manufacturing: I.C.T Engineers Set Up Complete Production Line in Tajikistan | I.C.T ( Dongguan ICT Technology Co., Ltd. )
  • Jun 20, 2024 - Case study: Precise Coating on Electronic Hearing Devices | ASYMTEK Products | Nordson Electronics Solutions
  • Mar 19, 2024 - What is Underfill | GPD Global
  • Browse Technical Library »

Approaches for additive manufacturing of 3D electronic applications article has been viewed times

High Throughput Reflow Oven
Component Placement 101 Training Course
Win Source Online Electronic parts

SMT Spare Parts and Feeders