Reliability Challenges in Fabrication of Flexible Hybrid Electronics for Human Performance Monitors: A System Level Study
Published: |
November 10, 2020 |
Author: |
Varun Soman, Student Member, IEEE, Yasser Khan, Madina Zabran, Mark Schadt, Member, IEEE, Paul Hart, Member, IEEE, Michael Shay, Member, IEEE, Frank Egitto, Member, IEEE, Konstantinos Papathomas, Member, IEEE, Natasha A. D. Yamamoto, Donggeon Han, Ana C. |
Abstract: |
Flexible hybrid electronics (FHE) interface rigid electronic components with flexible sensors, circuits, and substrates. This paper reports the reliability improvement of a FHE Human Performance Monitor (HPM), designed to monitor electrocardiography (ECG) signals.... |
|
Company Information:
More articles from Stanford University »
- Oct 08, 2020 - Design and Integration of aWireless Stretchable Multimodal Sensor Network in a Composite Wing
- See all SMT / PCB technical articles from Stanford University »
More SMT / PCB assembly technical articles »
- Jul 15, 2024 - Transforming LED Manufacturing: I.C.T Engineers Set Up Complete Production Line in Tajikistan | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Jun 20, 2024 - Case study: Precise Coating on Electronic Hearing Devices | ASYMTEK Products | Nordson Electronics Solutions
- Mar 19, 2024 - What is Underfill | GPD Global
- Mar 19, 2024 - Made in Japan: Solder Paste Jet Dispensing Machine | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Feb 26, 2024 - Precision Control in Electronic Assembly: Selective Wave Soldering Machine | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Browse Technical Library »
Reliability Challenges in Fabrication of Flexible Hybrid Electronics for Human Performance Monitors: A System Level Study article has been viewed 514 times